n features exb24at type : unbalanced p type l unbalanced p type attenuator circuit in one chip(1.0 mm 1.0 mm) l mounting cost reduction : mounting times 3 times ? 1 time l attenuation : 1 db to 10 db exb24ab type : balanced o type l balanced o type attenuator circuit in one chip(1.0 mm 1.0 mm) l mounting cost reduction : mounting times 4 times ? 1 time l attenuation : 0 db to 10 db n recommended applications cellular phones(gsm, cdma, pdc, etc.), phs, pda, for example. chip attenuator 0404 type: exb24at (unbalanced p type) type: exb24ab (balanced o type) chip attenuator l m o u n t i n g o c c u p a t i o n a r e a r e d u c t i o n : a b o u t 5 0 % r e d u c t i o n c o m p a r e d w i t h a n a t t e n u a t o r c i r c u i t c o n s i s t i n g o f t h r e e 0 4 0 2 c h i p r e s i s t o r s , a l m o s t e q u a l t o a n a t t e n u a t o r c i r c u i t c o n s i s t i n g o f t h r e e 0 2 0 1 c h i p r e s i s t o r s l m o u n t i n g o c c u p a t i o n a r e a r e d u c t i o n : a b o u t 6 4 % r e d u c t i o n c o m p a r e d w i t h a n a t t e n u a t o r c i r c u i t c o n s i s t i n g o f f o u r 0 4 0 2 c h i p r e s i s t o r s , a b o u t 2 6 % r e d u c t i o n c o m p a r e d w i t h a t t e n u a t o r c i r c u i t c o n s i s t i n g o f f o u r 0 2 0 1 c h i p r e s i s t o r s l a t t e n u a t i o n / l e v e l c o n t r o l / i m p e d a n c e m a t c h i n g o f h i g h f r e q u e n c y s i g n a l s o f c o m m u n i c a t i o n e q u i p m e n t ;
n attenuation-frequency characteristics (typical) (exb24at type) e 1 x 2 b 3 2 4 4 56 t 7 3 8 a 9 r 10 3 x 11 12 a e 1 x 2 b 3 2 4 4 56 b 7 3 8 g 9 r 10 8 x 11 12 a n explanation of part numbers l exb24at type : unbalanced p type l exb24ab type : balanced o type chip attenuator
n construction n circuit configuration n dimensions (not to scale) the bar marking for recognizing terminal direction is located on the side of terminal 4. dimensions (mm) lwtab 1.00 0.10 1.00 +0.10 0.35 0.10 0.33 0.10 0.15 0.10 c p(typical value) 0.25 0.10 0.65 dimensions (mm) chip attenuator exb24at exb24at exb24at exb24ab exb24ab exb24ab dimensions (mm) lwt a b 1.00 0.10 1.00 +0.10 0.35 0.10 0.33 0.10 0.15 0.10 c p(typical value) 0.30 0.10 0.65 dimensions (mm)
type thickness (mm) weight (mg) punched (paper) taping (2 mm pitch) (inches) exb24at/ab 0.35 1.1 10000 pcs./reel (0404) n packaging methods n taping dimensions l taping reel l punched (paper) taping f a f b f c wt 180.0 60 min. 13.0 1.0 9.0 1.0 11.4 2.0 e3.0 dimensions (mm) abwfe 1.20 0.05 1.20 0.05 8.00 0.20 3.50 0.05 1.75 0.10 p 0 p 1 p 2 f d 0 t 4.00 0.10 2.00 0.10 2.00 0.05 1.50 +0.10 0.45 0.10 0 products shall be sealed so as to locate the terminal 1 and 2 on the side of feeding direction in the chip pocket. chip attenuator dimensions (mm) dimensions (mm) 0 attenuation value attenuation value tolerance characteristic impedance power rating frequency range vswr (voltage standing wave ratio) number of resistors number of terminals category temperature range (operating temperature range) 50 w * 0.04 w /package dc to 2 ghz 1.3 max. 3 resistors 4 terminals - 55 ?c to + 125 ?c item n ratings exb24at 1 db, 2 db, 3 db, 4 db, 5 db, 6 db, 10 db * 1 db, 2 db, 3 db, 4 db, 5 db : 0.3 db 6 db, 10 db : 0.5 db * please inquire about the other attenuator value / characteristics impedance. power derating curve for resistors operated in ambient temperature above 70?c, power rating shall be derated in accordance 100 w, 200 w, 300 w * 0.04 w /package dc to 2.5 ghz 1.2 max.(typical value) 1.5 max.(0 db, typical value) 4 resistors 4 terminals - 55 ?c to + 125 ?c exb24ab 0 db, 1 db, 2 db, 3 db, 6 db, 10 db * 0 db to 3 db : 0.8 db 6 db 10 db : 1.0 db : 2.0 db w i t h t h e f i g u r e o n t h e r i g h t . l s t a n dard quantity
1. soldering recommendation for soldering method is noted below. l reflow soldering rising temperature i the normal to preheating temperature 30 s to 60 s preheating 140 ?c to 160 ?c 60 s to 120 s rising temperature ii preheating to 200 ?c 20 s to 40 s main heating (cf. the limits of resistance to reflow soldering heat) gradual cooling 200 ?c to 100 ?c 1 ?c/s to 4 ?c/s l flow soldering narrow 0.65 mm pitch. l iron soldering 1 solder at 280 ?c max. and 3 seconds max. with the soldering iron tip. 2 the soldering iron tip shall not touch the protective coating of the part. l use rosin type flux. do not use high-activity flux (the chlorine content is 0.2 wt % or more). l allow enough preheating so that the difference of soldering temperature and temperature of surface of the part is 100 ?c or less. this temperature difference shall be kept in rapid cooling by immersion into solvent. characteristics. avoid excessive amount of solder. 2. cleaning l residual flux after board washing may cause solder migration. carefully check the status of board washing. trouble. 3. others l l do not use the product in dewy atmosphere. (reflow soldering shall be within two times.) chip attenuator n recommend land pattern dimensions (mm) abcd 0.5 0.35 to 0.4 0.3 1.4 to 1.5 s a f e t y p r e c a u t i o n s p r e c a u t i o n s a n d r e c o m m e n d a t i o n s a r e d e s c r i b e d b e l o w . l p l e a s e i n q u i r e w i t h u s w h e n y o u u s e t h e d i f f e r e n t c o n d i t i o n s . l p l e a s e m e a s u r e a t e m p e r a t u r e o f t e r m i n a t i o n s a n d s t u d y t h e s o l d e r a b i l i t y f o r e v e r y t y p e o f b o a r d b e f o r e u s i n g . l u s e o f m o r e s o l d e r r e s u l t s i n m o r e m e c h a n i c a l s t r e s s t o t h e p a r t r e s u l t i n g i n c r a c k i n g o r i m p a i r e d s t u d y t h e t y p e a n d a m o u n t o f f l u x t o b e u s e d w h e n n o w a s h i n g i s m a d e . s t u d y t h e t y p e o f w a t e r - s o l u b l e f l u x a n d c l e a n i n g a g e n t a n d d r y i n g c o n d i t i o n w h e n w a t e r w a s h i n g i s d o n e . c o n f i r m t h e y w i l l n o t c a u s e a n y t a k e n e c e s s a r y p r e c a u t i o n s t o a v o i d a n y a b n o r m a l s t r e s s c a u s e d b y b e n d i n g o f b o a r d . w e c a n n o t r e c o m m e n d t h e f l o w s o l d e r i n g , b e c a u s e a solder bridge may occur owing to
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